VOXL2 thermal management
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We are incorporating the VOXL2 into an enclosed payload. Are there specific components that are main sources of heat that we should take extra precaution at dissipating?
Hi @jaredjohansen
Thanks for reaching out.
We recently wrote up this page to help:
https://docs.modalai.com/voxl2-thermal-performance/As far as what components require the focus, it is certainly the QRB5165 module on Voxl 2 that will be the predominate power source.
On one side, we have the LPDDR5 SDRAM, that tends to be the limiting factor. Although not the source of the heat, it sits above the CPUs so it is the most accessible for thermal dissipation. We suggest trying to make sure you have airflow flowing over this portion:
(Zoom in, the part that pokes through the PCB hole)
The secondary side will also help, but not as much. This side has much of the internal power control ICs, but due to the relative mass, may not feel as warm, but the same mass and volume/area helps provide more area for airflow to work:
We made a conscience decision on Voxl2 to place the B2B connectors J3 and J5 on that side exactly because of that concern. The expectation is that any plug-in boards will not impede airflow from being on the LPDDR side, thus leaving only small image sensor flexes to work around for airflow.
Hope this helps!
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