@Alex-Kushleyev
Dear Alex Khushlevyev
Thanks for the detailed mail. We shall do the test as suggested by you. Yes, this is the kind of behavior that we too observed although we have not logged the data in a file for plotting.
It is unlikely that in an open bench test the rising CPU temperature can transfer so quickly the heat energy to the baro chip through convection (air). It must be the power tracks beneath the baro chip helping to transfer that heat energy through conduction (copper+FR4). Anyway it is to your PCB design team to confirm this.
The immediate solution, for the mini users, I think will be one of the following:
A) implement temp compensation in the code.
B) install an external baro with I2C interface.
I once again request you to share the steps to install an external baro (BMP280).
(Talking of PCB layout one more thing needs your immediate attention. On Voxl2 mini with J6 and J7 one has to use your interposer (splitter) board, in which case you can't use that respective main board-mounting hole... It fouls. This is the case with either of the interposer boards, single /dual.. It is road-block to use even a single camera with mini. It is very surprising that the spitter boards are not redesigned yet... A minuscule task to address such a glaring fault, is not undertaken yet)
Thanks
Rama Rao